As China prepares to celebrate the Lunar New Year, Xiaomi is preparing to release the Redmi K50 series. The new models are expected to arrive in February and will come with a mix of high-end Snapdragon and Dimension chipsets - but not at the same time. Lu Weibing told fans that first comes the Snapdragon 8 Gen 1 model, followed by the Dimension 9000 model.
Redmi K50, K50 Pro, K50 Pro + and K50 Gaming - there is still some uncertainty as to which models will get which chips and a total of four phones are coming.
The current idea is to get Qualcomm chips for both Pro models, the Snapdragon 8 Gen 1 for the Redmi K50 Pro + and the Snapdragon 870 for the regular Pro.
The other two are available on the MediaTek chipset. The Redmi K50 Gaming Dimension is expected to be offered by 9000 chipset, which has shown some excellent benchmark results. Although Oppo and Realme use the same chip as Vivo and Honor, this may be the first phone to use the new chip. This is a popular chip.
The Redmi K50 is expected to use a new chip from MediaTek, which we have reported as Dimension 7000 (sometimes referred to as 8000). Unlike the Snapdragon 8 Gen 1 and Dimension 9000, early rumors suggest that it will be a 5nm chip without the Cortex-X2 cores (hence the four A78s and four ***) and the Mali-G510 MC6. It will be interesting to see how this works out against the Redmi K50 Pro's Snapdragon 870 - the naming suggests that the Pro will be faster, and the dimensions will change with the hardware specs (if accurate) to a better chip.
Chipset aside, the K50 Series MIUI 13 comes with 50W of charging for the base model and 120W for the Pros, as well as a 108 MP camera and periscope. The gaming model will retain its shoulder triggers and is likely to be released as the next Poco F GT in some areas (Xiaomi also promises the best haptic engine yet).